038222AS4 · USDInvestment Grade · A

Applied Materials Inc 4.80% 2029/06

Applied Materials IncSenior Unsecured
MID PRICE
101.77
par = 100
YIELD TO MAT.
4.81%
semi-annual
COUPON
4.800%
semi-annual · fixed
MATURITY
2029-06-15
bullet · 3.12y
OUTSTANDING
not disclosed
AS OF
2026-04-30
Fund disclosure

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About this bond

AI BRIEF · GROUNDED IN STRUCTURED DATA
About the issuer

Applied Materials, Inc. is an American corporation that supplies equipment, services and software for the manufacture of semiconductor chips for electronics, flat panel displays for computers, smartphones, televisions, and solar products. The company also supplies equipment to produce coatings for flexible electronics, packaging and other applications. The company is headquartered in Santa Clara, California, and is the second largest supplier of semiconductor equipment in the world based on revenue behind Dutch company ASML.

Source: Wikipedia →

Risk analytics

SEMI-ANNUAL · BULLET · PAR 100
Modified duration
2.81 y
1bp ↑ ≈ -0.028% P&L
Convexity
9.72
higher = more curvature
Years to maturity
3.12 y
YTM source
Ingested
Fund disclosure
Market signals · funds disclosing this bond
SignalCategoryExposureLast moveWeightAs of
Invesco BulletShares 2029 Corporate Bond
Invesco
BulletShares 2029 Corporate$5.2M▲ $2K0.19%2026-04-30
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Price history

Sherpa Signal

AS OF 2026-04-30

Institutional footprint · signal-level holdings

14/ 100Minimal footprint
Interpretation. Minimal institutional footprint, holding
HOLDERS
1
unchanged in 7d
AGGREGATE EXPOSURE
$5.2M
USD across all
TOP CONCENTRATION
100.0%
largest holder
FLOW
▼ $14K
unchanged in 7d

Sherpa Signal is derived from a panel of tracked institutional portfolios. Names of individual holders are not disclosed.

100K PAR NOTIONAL · MARKET VALUE
101,770 USD
PRICE
101.77

RFQ routing · coming soon

Security details

AWAITING ENRICHMENT
Face value
100 USD
Seniority
Senior Unsecured

Issuer curve

Applied · 10 PTS

Yield (%) plotted against years-to-maturity. This bond highlighted in amber.